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DDR
DDR3
 

MoSys’ silicon proven DDR3 support a wide range of data-rates from 800Mbps to 2133Mbps. Chip designers obtain access to risk-free silicon-proven hardened PHY macros at advanced process nodes.

MoSys’ DDR3 PHYs are JEDEC compliant and DFI 2.1 compliant. The PHY is a complete hardened macro requiring no additional IP components. It delivers seamless interoperability with industry standard controllers.


DDR 3


Key Benefits

  • Silicon validated designs ensuring lowest risk
  • FlipChip ready design supporting 2133 Mbps
  • Wirebond ready design supporting 1600 Mbps
  • 2.5V or 1.8V IO FET support
  • DFI 2.1 Compliant
  • Proven interoperability with industry standard memory controllers

Availability

  • TSMC 40G
  • TSMC 65GP
  • Please contact MoSys for all other process variants

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Our Applications


  • NetworkingConsumer/GraphicsComputingStorage
Our Applications MoSys in Networking
The explosive demand for internet bandwidth is driving the need for next generation network systems. These systems require significantly more...

Our Applications MoSys in Computing
Improved performance and the trend towards multi-core computing is driving the need for next generation high end computing systems...

Our Applications MoSys in Consumer/Graphics
MoSys differentiated and patented 1T-SRAM embedded memory IP enables next generation networking SoCs to have 3 times the density in the same...

Our Applications MoSys in Storage
The dramatic explosion in information within the enterprise across the extended network in high end storage systems, and the need to have...