Home > Partners & Affiliations    
Partners & Affiliations
Partners
Industry Affiliations
 
Partners & Affiliations


Altera Corporation

Altera programmable solutions enable system and semiconductor companies to rapidly and cost-effectively innovate, differentiate and win in their markets. Find out more about Altera's FPGA, CPLD and ASIC devices at www.altera.com. Follow Altera via Facebook, RSS and Twitter.
 

Avago Technologies

Avago Technologies is a leading supplier of analog interface components for communications, industrial and consumer applications. By leveraging its core competencies in III-V compound and silicon semiconductor design and processing, the company provides an extensive range of analog, mixed signal and optoelectronics components and subsystems to approximately 40,000 end customers. Backed by strong customer service support, the company's products serve four diverse end markets: wireless communications, wired infrastructure, industrial and automotive electronics, and consumer and computing peripherals. Avago has a global employee presence and heritage of technical innovation dating back 50 years to its Hewlett-Packard roots. Information about Avago is available on the Web at www.avagotech.com.
 

HiTech Global

HiTech Global is a U.S. based design house and distributor located in San Jose, California. HiTech Global's products include IP Cores, FPGA base evaluation/prototyping boards, application specific modules (DSP, Processing, Video, etc.), application specific systems, design tools (HW/SW debuggers, emulators, operating Systems, verification, etc.), software/drivers, and IC components. HiTech Global also provides FPGA, ASIC, SOC, and PCB design services. Our expert design Engineering teams can complete your projects with minimum turnaround time and design cycle in order to meet your time-to-market requirements. For more information, please visit www.hitechglobal.com.
 

TSMC

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry. As the founder and leader of this industry, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry industry's leading technologies to its customers. The company's manufacturing capacity exceeds 8 million 8-inch equivalent wafers in 2007, while its revenues represent some 50% of the dedicated foundry segment in the semiconductor industry. For more information, please visit www.tsmc.com.
 

Xilinx, Inc.

 

Xilinx develops All Programmable technologies and devices, beyond hardware to software, digital to analog, and single to multiple die in 3D ICs. These industry leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

 
 


Industry Affiliations

IEEE

IEEE is the world’s largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity. IEEE and its members inspire a global community through IEEE's highly cited publications, conferences, technology standards, and professional and educational activities. For more information, visit www.ieee.org.
 

JEDEC

JEDEC brings manufacturers and suppliers together to participate in more than 50 committees and subcommittees, with the mission to create standards to meet the diverse technical and developmental needs of the industry. JEDEC’s collaborative efforts ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs. JEDEC publications and standards are accepted throughout the world, and are free and open to all. For more information, visit www.jedec.org.
 

Optical Internetworking Forum (OIF)

The Optical Internetworking Forum (OIF) promotes the development and deployment of interoperable networking solutions and services through the creation of Implementation Agreements (IAs) for optical networking products, network processing elements, and component technologies. Implementation agreements will be based on requirements developed cooperatively by end-users, service providers, equipment vendors and technology providers, and aligned with worldwide standards, augmented if necessary. This is accomplished through industry member participation working together to develop specifications (IAs) for:

  • External network element interfaces
  • Software interfaces internal to network elements
  • Hardware component interfaces internal to network elements

The OIF will create Benchmarks, perform worldwide interoperability testing, build market awareness and promote education for technologies, services and solutions. The OIF will provide feedback to worldwide standards organizations to help achieve a set of implementable, interoperable solutions.