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Partners & Affiliations
Partners & Affiliations

Altera Corporation

Altera programmable solutions enable system and semiconductor companies to rapidly and cost-effectively innovate, differentiate and win in their markets. Find out more about Altera's FPGA, CPLD and ASIC devices at www.altera.com. Follow Altera via Facebook, RSS and Twitter.


CoreEL Technologies

CoreEL Technologies is a Customer Application Specific Product & Solutions (CASPS) company offering innovative solutions from its diverse portfolio of offerings that include Intellectual Property (IP) cores, System Design, Prototype Development, Manufacturing, Sustenance, Next-gen products, Semiconductor solutions, EDA tools, COTS products and Technology Training. Visit www.CoreEL.com for more information.



EZchip is a fabless semiconductor company that provides high-performance processing solutions for a wide range of applications for the carrier, cloud and data center networks. EZchip’s broad portfolio of solutions scales from a few to hundreds of Gigabits-per-second, and includes network processors, multi-core processors, intelligent network adapters, high-performance appliances and a comprehensive software ecosystem. EZchip’s processing solutions excel at providing great flexibility and high performance coupled with superior integration and power efficiency.


GSI Technology

Founded in 1995, GSI Technology, Inc. is a leading provider of high-performance static random access memory, or SRAM, products primarily incorporated in networking and telecommunications equipment. Headquartered in Sunnyvale, California, GSI Technology is ISO 9001 certified and has worldwide factory and sales locations. For more information, please visit www.gsitechnology.com.


HiTech Global

HiTech Global is a U.S. based design house and distributor located in San Jose, California. HiTech Global's products include IP Cores, FPGA base evaluation/prototyping boards, application specific modules (DSP, Processing, Video, etc.), application specific systems, design tools (HW/SW debuggers, emulators, operating Systems, verification, etc.), software/drivers, and IC components. HiTech Global also provides FPGA, ASIC, SOC, and PCB design services. Our expert design Engineering teams can complete your projects with minimum turnaround time and design cycle in order to meet your time-to-market requirements. For more information, please visit www.hitechglobal.com.


Macnica Americas

Macnica Americas Inc. is a subsidiary of the $2.4B Macnica group headquartered in Yokohama, Japan. We offer franchised distribution in North America with a design service center located in San Diego, California. Our IP portfolio include solutions for high speed networking, broadcast video, DSP and embedded applications. Find out more about Macnica America suppliers and design services at www.macnica-na.com.



Established in 1987, TSMC is the world's largest dedicated semiconductor foundry. As the founder and leader of this industry, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry industry's leading technologies to its customers. The company's manufacturing capacity exceeds 8 million 8-inch equivalent wafers in 2007, while its revenues represent some 50% of the dedicated foundry segment in the semiconductor industry. For more information, please visit www.tsmc.com.


Xilinx, Inc.

Xilinx develops All Programmable technologies and devices, beyond hardware to software, digital to analog, and single to multiple die in 3D ICs. These industry leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.


Industry Affiliations


IEEE is the world’s largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity. IEEE and its members inspire a global community through IEEE's highly cited publications, conferences, technology standards, and professional and educational activities. For more information, visit www.ieee.org.



JEDEC brings manufacturers and suppliers together to participate in more than 50 committees and subcommittees, with the mission to create standards to meet the diverse technical and developmental needs of the industry. JEDEC’s collaborative efforts ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs. JEDEC publications and standards are accepted throughout the world, and are free and open to all. For more information, visit www.jedec.org.


Optical Internetworking Forum (OIF)

The Optical Internetworking Forum (OIF) promotes the development and deployment of interoperable networking solutions and services through the creation of Implementation Agreements (IAs) for optical networking products, network processing elements, and component technologies. Implementation agreements will be based on requirements developed cooperatively by end-users, service providers, equipment vendors and technology providers, and aligned with worldwide standards, augmented if necessary. This is accomplished through industry member participation working together to develop specifications (IAs) for:

  • External network element interfaces
  • Software interfaces internal to network elements
  • Hardware component interfaces internal to network elements

The OIF will create Benchmarks, perform worldwide interoperability testing, build market awareness and promote education for technologies, services and solutions. The OIF will provide feedback to worldwide standards organizations to help achieve a set of implementable, interoperable solutions.