NEC Ships Over 25 Million Mosys 1t-Sram 96-Mbit Memory Chips


NEC Extends Agreements on 1T-SRAM Technology to 90 nanometer Logic Process

SUNNYVALE, CALIFORNIA and TOKYO, JAPAN (October 14, 2002) -MoSys, Inc. (NASDAQ: MOSY) the industry's leading provider of high density SoC embedded memory solutions and NEC Corporation (NYSE: NIPNY), today announced that NEC has shipped more than 25 million units of the 96-Mbit high-density 1T-SRAMÒ memory chips in one year after the launch of the Nintendo GameCube„™ which uses these very high-performance custom chips as its main system memory. The companies announced that they have extended NEC's license agreement for MoSys 1T-SRAM memory technologies for additional projects in embedded DRAM and logic processes with geometries down to 90 nanometers.

Perrin Kaplan, vice president, marketing & corporate affairs at Nintendo of America Inc. said "We are very pleased with the successful partnership we have with both NEC and MoSys, allowing us to leverage their technologies to produce a unique gaming experience with Nintendo GameCube for our customers."

"NEC is delighted to continue its long-term relationship with Nintendo with the achievement of this significant production milestone for the Nintendo GameCube," said Takashi Okuda, chief manager, of the System Memory Development Division at NEC Corporation.

"MoSys is proud of its contribution to the success of Nintendo GameCube," commented Mark-Eric Jones, vice president and general manager of intellectual property at MoSys. "These new NEC agreements build on the production success to broaden our relationship into additional processes and geometries."

The Nintendo GameCube includes 192 Mbits of very high performance, low-latency 1T-SRAM memory as its main system memory to help achieve consistent graphics performance that provides customers with a unique gaming experience and simplifies the implementation of the latest video games by their creators.

ABOUT NEC

NEC Corporation (NASDAQ: NIPNY) (FTSE: 6701q.1) is one of the world's leading providers of Internet, broadband network and enterprise business solutions dedicated to meeting the specialized needs of its diverse and global base of customers. Ranked as one of the world's top patent-producing companies, NEC delivers tailored solutions in the key fields of computer, networking and electron devices, through its three market-focused, in-house companies: NEC Solutions, NEC Networks and NEC Electron Devices. NEC Corporation employs more than 140,000 people worldwide and had net sales of approximately $39 billion in the fiscal year ended March 2002. For additional information, please visit the NEC home page at: http://www.nec.com.

ABOUT MOSYS
Founded in 1991, MoSys (NASDAQ: MOSY), develops, licenses and markets innovative memory technology for semiconductors. MoSys' patented 1T-SRAM technologies offer a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies. The single transistor bit cell used in 1T-SRAM technologies results in the technologies achieving much higher density than traditional four or six transistor SRAMs while using the same standard logic manufacturing processes. 1T-SRAM technologies also offer the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, this technology can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making it an ideal technology for embedding large memories in System-on-Chip (SoC) designs. 1T-SRAM technologies are in volume production both in SoC products at MoSys' licensees as well as in MoSys' stand alone memories. MoSys is headquartered at 1020 Stewart Drive, Sunnyvale, California 94085. More information is available on MoSys' Web site at http://www.mosys.com.

###

Note for Editors:
1T-SRAM® is a MoSys trademark registered in the U.S. Patent and Trademark Office. Nintendo GameCube is a trademark of Nintendo. All other trade, product, or service names referenced in this release may be trademarks or registered trademarks of their respective holders.