This event will highlight the key technologies for next-generation networks and the components that will enable them. The event will be of interest not only to network equipment manufacturers and service providers, but also to investors and semiconductor suppliers.
Data Center Interconnects (Panel 1) with MoSys VP of Sales and Marketing, John Monson, along side panelsts from Broadcom, Optical Internetworking Forum and Source Photonics.
Panel description: Server performance and data center network traffic are growing dramatically. The traditional data center network architecture is being challenged by innovative approaches using both standardized and proprietary interconnects between servers and switches, and within the systems. New solutions and technologies becoming available include new modulations, high speed copper interconnects and silicon photonics. Solutions are being developed to support low cost 100G optical links up to 2km and optical connections within systems. 28 Gbit/s serial links over backplanes and to optical modules are also becoming available and the next generation currently in development will support 56 Gbit/s. This session will cover the latest developments, including data center architectures and the technologies and components for competing optical and copper interconnects.
Santa Clara Convention Center
Santa Clara, California
DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. Now in its 20th year, DesignCon offers state-of-the-art design methodologies, applications and technologies, as well as unparalleled networking opportunities.
Los Angeles Convention Center
Los Angeles, California
OFC is the largest global conference and exposition for optical communications and networking professionals. For over 40 years, The Optical Fiber Communication Conference and Exposition (OFC) has drawn attendees from all corners of the globe to meet and greet, teach and learn, make connections and move business forward.