See MoSys technology at this year’s OIF Interoperability demos at ECOC 2013.

Particpants include: Amphenol, Applied Micro, Cisco, Finisar, Fujitsu Optical Components, Inphi, Molex, MoSys, Semtech, TE Connectivity, and Xilinx.

Technologies demonstrated during the testing include host ICs with VSR SerDes capability, host PCB traces, optical module connectors, high-speed electrical I/O and backplane connectors, module retimers, heat sinks and optical transceivers all operating with 28G electrical interfaces. Agilent Technologies Inc. and Tektronix, Inc. will supply test equipment used in the demonstration.

Click here for the full press release.