Author: John Monson, VP of Marketing & Sales
Abstract: For next-generation platforms and high-density line cards to extend into the Terabit per second range, low power, high-speed 25G+ PHYs, high-density connections at the faceplate, and flexibility of device placement will be required. In order to meet these requirements, 25G+ CDR and PHY devices must support a wide variety of rates and configurations, flexible distances, and broad electrical standards and improve ease-of-use. In this talk, MoSys will introduce its latest LineSpeed PHY technology and describe application trends, timelines and trade-offs for future platforms.
Day 2, Session 5: Pervasive 100G Interconnects presentation by MoSys is available by request from The Linley Group.